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6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit

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6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit

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Solder mask : Green

PCB size : 131mm × 107mm (custom single piece)

Layer count : 6-Layers

Surface finish : Immersion Silver

PCB thickness : 0.994mm

Copper weight : Inner Layer: 0.5oz; Outer Layer: 1oz

Silkscreen : White

Base material : MT77 Astra ultra-low loss high-frequency laminate

Brand Name : Bicheng

Model Number : BIC-261.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

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This 6 Layer MT77 Astra PCB is a premium ultra-low loss high-frequency circuit board engineered for high-precision RF and microwave applications. Fabricated with three pieces of 0.127mm MT77 Astra core laminates and matched MT77 Astra prepreg, this custom high-frequency PCB delivers a finished board thickness of 0.994mm. It adopts a professional hybrid copper structure with 0.5oz inner copper layers for fine-line routing and 1oz outer copper layers for stable high-frequency signal transmission.

Featuring Immersion Silver surface finish, green solder mask, and white silkscreen, this automotive-grade RF PCB adopts advanced industrial processes including G12 resin plugging with full electroplating filling and customized L1-L2, L5-L6 blind vias. Fully compatible with FR-4 fabrication workflow, HDI layout and VIPPO design, the MT77 Astra 6-layer PCB features ultra-low 0.0017 Df loss and wide-temperature stable Dk performance. As a cost-effective alternative to expensive PTFE microwave substrates, it is widely used for automotive radar, long-range antennas and commercial microwave communication devices, certified with UL E41625 and RoHS compliance.

What Is MT77 Astra? Low Loss High-Frequency PCB Material

MT77 Astra is a professional thermoset high-frequency laminate customized for modern commercial RF, microwave and automotive radar PCB designs. This high-performance substrate maintains extremely stable dielectric constant (Dk) across a wide temperature range from -40°C to +140°C and supports W-band high-frequency operation. Different from conventional high-loss PCB materials, MT77 Astra eliminates electrical parameter drift under extreme thermal and frequency changes, ensuring consistent and reliable circuit output in complex working environments.

Featured with an ultra-low dissipation factor of Df=0.0017, MT77 Astra effectively minimizes high-frequency signal attenuation and transmission loss, delivering microwave-level electrical performance at a much lower production cost than PTFE materials. This high-frequency laminate boasts excellent manufacturability, full FR-4 process compatibility, superior dimensional stability and multi-lamination adaptability. Supporting HDI miniaturization, any-layer interconnection and VIPPO structural design, MT77 Astra is fully lead-free assembly compatible, UL certified and RoHS compliant, ideal for mass production of high-end RF electronic products.

6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit

MT77 Astra PCB Features

Core Feature Technical Parameter
Ultra-Low Dissipation Factor Df = 0.0017 @ high-frequency band
Wide-Range Dk Stability Stable Dk: -40°C to +140°C, W-band capable
PTFE Alternative Performance Non-PTFE high-frequency composite substrate
Hybrid Copper Thickness Design 0.5oz inner copper / 1oz outer copper
G12 Resin Plugging Process G12 resin plugging + full electroplating filling
Custom Blind Via Structure L1-L2, L5-L6 controlled blind vias
Global Industrial Certification UL E41625, RoHS, Lead-free assembly compatible

MT77 Astra PCB Processing & Manufacturing Advantages

Compared with traditional high-frequency substrates, MT77 Astra PCB material combines premium electrical performance and excellent mass-production manufacturability, supporting high-precision HDI multi-layer PCB fabrication with higher yield and lower cost:

Full FR-4 Process Compatibility: No special equipment required; fully adaptable to standard FR-4 production lines, effectively lowering technical thresholds and manufacturing costs for high-frequency PCB production

High-Efficiency Lamination Performance: Features short lamination cycles, supports repeated multi-lamination processes, and provides excellent resin flow and filling effect for complex multi-layer structures

Simplified Machining Workflow: Reduces drill bit wear during hole processing and eliminates plasma desmear procedures, greatly improving production efficiency and finished product yield rate

Superior Dimensional Stability: Maintains stable board flatness and precise dimensional tolerance after repeated thermal cycling, avoiding board deformation and layer misalignment defects

Advanced Design Compatibility: Fully compatible with any-layer interconnection, HDI miniaturization technology and VIPPO design, supporting high-density compact high-frequency PCB layout

6 Layer MT77 Astra PCB Full Specifications

Parameter Item Detailed Specification
Base Material MT77 Astra ultra-low loss high-frequency laminate + matching prepreg
PCB Layers 6-layer rigid high-frequency PCB structure
Board Size 131mm × 107mm (custom single piece)
Finished Board Thickness 0.994mm
Copper Weight Inner Layer: 0.5oz; Outer Layer: 1oz
Surface Finish Immersion Silver, anti-oxidation, stable high-frequency conductivity
Solder Mask & Silkscreen Green solder mask + white silkscreen for durable protection and clear marking
Special Processes G12 resin hole plugging + full electroplating filling; L1-L2 & L5-L6 blind vias

6-Layer MT77 Astra PCB Stack-up Structure

6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit

MT77 Astra Material Technical Specifications

Item Detailed Specification
Standard Laminate Thickness 2.5 / 5 / 7.5 / 10 / 12.5 / 15 / 20 / 30 / 60 mil (0.0635mm–1.50mm)
Copper Foil Type HVLP (VLP2) ≤2.5μm Rz JIS, embedded resistor foil optional
Available Copper Weight 0.5oz / 1oz / 2oz (18μm / 35μm / 70μm), custom ultra-thin copper available
Prepreg Service Professional panel tooling + moisture-proof vacuum barrier packaging

6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit

Custom PCB Service & Quality Assurance

Artwork Format: We support standard Gerber RS-274-X design files for custom MT77 Astra high-frequency PCB manufacturing, ensuring precise and repeatable fabrication results for all RF and microwave circuit projects.

Strict Quality Control: All MT77 Astra 6-layer PCBs comply with IPC-Class-2 standards. Every finished board undergoes 100% pre-shipment electrical testing to eliminate open/short defects and guarantee stable batch consistency.

Global Custom Service: We provide one-stop customized PCB solutions including professional technical consultation, personalized quotation and worldwide shipping for all PCB orders.

MT77 PCB Main Applications

  • Automotive Radar Systems
  • Long-Range Communication Antennas
  • RF & Microwave Circuit Modules
  • Vehicle-Mounted High-Frequency Electronics
  • W-Band High-Frequency Devices

Conclusion

This 6 Layer MT77 Astra Ultra-Low Loss RF PCB is a high-performance microwave-grade circuit board optimized for automotive radar and high-frequency communication devices. With an ultra-low dissipation factor of 0.0017, stable dielectric performance from -40°C to +140°C and full FR-4 process compatibility, it delivers PTFE-level RF performance at lower manufacturing costs. Equipped with G12 resin plugging, precision blind via structure and hybrid copper thickness design, this certified high-frequency PCB is the ideal cost-effective replacement for imported microwave substrates, suitable for mass production of high-end automotive radar, long-range antenna and precision microwave electronic products.

6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit


Product Tags:

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