This PCB is a high-performance double-sided (2-layer) rigid board, constructed in strict accordance with relevant specifications to ensure reliable functionality and stable performance. It adopts Rogers TMM10i isotropic thermoset microwave material as the base material, suitable for various high-frequency applications that require excellent dielectric properties and reliability.
PCB specification
| Item | Details |
| Base Material | Rogers TMM10i |
| Layer Count | Double sided (2 layers, no blind vias) |
| Board Dimensions | 102.8mm x 59mm per piece, with a tolerance of +/- 0.15mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.25mm |
| Finished Board Thickness | 0.5mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Pure Gold Plating (No nickel) |
| Silkscreen | No silkscreen on both top and bottom layers |
| Solder Mask | No solder mask on both top and bottom layers |
| Quality Control | 100% Electrical test conducted prior to shipment |
PCB Stack-up
| Layer | Specifications |
| Copper Layer 1 | 35 μm |
| Rogers TMM10i Core | 0.381 mm (15 mil) core substrate |
| Copper Layer 2 | 35 μm |
Artwork and Quality Standard
Type of Artwork Supplied: Gerber RS-274-X, which is recognized as the global industry standard for PCB fabrication.
Quality Standard: IPC-Class-2, a widely adopted quality benchmark formulated by the Association Connecting Electronics Industries (IPC) for printed circuit boards.
Availability
This PCB is available for worldwide shipping to meet the diverse needs of global projects.
Introduction to Rogers TMM10i Base Material
Rogers TMM10i isotropic thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. TMM10i microwave material has an isotropic dielectric constant (Dk). Like the other TMM series materials, TMM10i combines many of the desirable features of ceramic and PTFE substrates, with the ease of soft substrate processing techniques.
Key Features of Rogers TMM10i Material
| Key Features | Specifications & Descriptions |
| Dielectric Constant (Dk) | 9.80 +/- 0.245 |
| Dissipation Factor | 0.0020 at 10GHz |
| Thermal Coefficient of Dk | -43 ppm/°K |
| Coefficient of Thermal Expansion (CTE) | Matched to copper; x=19 ppm/K, y=19 ppm/K, z=20 ppm/K |
| Decomposition Temperature (Td) | 425 °C (TGA) |
| Thermal Conductivity | 0.76 W/mk |
| Available Thickness Range | 0.0015 to 0.500 inches +/- 0.0015” |
Benefits of Using Rogers TMM10i Material
-Mechanical properties resist creep and cold flow, maintaining structural integrity over time
-Resistant to process chemicals, reducing damage during PCB fabrication
-Material does not require a sodium napthanate treatment prior to electroless plating
-Based on a thermoset resin, allowing for reliable wire-bonding
-Ensures reliable wire-bonding performance
Typical Applications
-RF and microwave circuitry
-Power amplifiers and combiners
-Filters and couplers
-Satellite communication systems
-Global Positioning Systems (GPS) Antennas
-Patch Antennas
-Dielectric polarizers and lenses
-Chip testers
Conclusion
This PCB demonstrates excellent high-frequency performance, reliable structural stability, and superior manufacturability, which are attributed to the outstanding properties of Rogers TMM10i material and rigorous quality control procedures.
These characteristics make it an ideal choice for global manufacturers seeking a cost-effective and reliable solution for high-frequency and precision electronic projects—particularly those involving RF and microwave devices that require consistent performance, wide accessibility, and compatibility with standard production workflows.
